this is information on a product in full production. march 2013 docid023215 rev 3 1/9 9 bal-nrf01d3 50 ohm balun transforme r for 2g45 ism matched nordic semiconductor chips wit h ultralow power transceivers datasheet ? production data figure 1. pinout diagram (top view) features ? 50 ? nominal input / conjugate match to nordic semiconductor chips nrf24le1 qfn32, nrf24ap2-1ch, nrf24ap2-8ch, nrf51422 and nrf51822 ? low insertion loss ? low amplitude imbalance ? low phase imbalance ? small footprint: < 1.5 mm 2 benefits ? very low profile: < 595 m after reflow ? high rf performance ? rf bom and area reduction applications ? 2.45 ghz impedance matched balun filter ? optimized for nordic's chip set nrf24le1/ap2 and nrf51 series description stmicroelectronics bal-nrf01d3 is an ultraminiature balun. the bal-nrf01d3 integrates matching network and harmonics filter. matching impedance has been customized for the following nordic semiconductor circuits: nrf24le1 qfn-32 pins, nrf24ap2-1ch, nrf24ap2-8ch, nrf51422 and nrf51822. the bal-nrf01d3 uses stmicroelectronics ipd technology on non-conductive glass substrate which optimize rf performances. the bal-nrf01d3 has been tested and approved by nordic semiconductor in their nrf2723 and nrf2752 nrfgo modules. lead-free flip-chip package 5 bumps se diff diff vcc gnd a b c 1 2 3 www.st.com
characteristics bal-nrf01d3 2/9 docid023215 rev 3 1 characteristics table 1. absolute maximum ratings (limiting values) symbol parameter value unit min. typ. max. p in input power rfin 20 dbm v esd esd ratings mil std883c (hbm: c = 100 pf, r = 1.5 k ? , air discharge) 2000 v esd ratings charge device model (jesd22-c101-c) 500 esd ratings machine model (mm: c = 200 pf, r = 25 ? , l = 500 nh) 200 t op operating temperature -40 +85 c table 2. impedances (t amb = 25 c) symbol parameter value unit min. typ. max. z out nominal differential output impedance conjugate match to nrf24le1/ap2, nrf51422, nrf51822 ? z in nominal input impedance 50 ? table 3. rf performance (t amb = 25 c) symbol parameter test condition value unit min. typ. max. f frequency range (bandwidth) 2400 2540 mhz i l insertion loss in bandwidth 2.25 db r l return loss in bandwidth 10 db ? imb phase imbalance 3 aimb amplitude imbalance 0.1 db 2f0 2nd harmonic filtering 4880 mhz 10 db 3f0 3rd harmonic filtering 7320 mhz 20 db
docid023215 rev 3 3/9 bal-nrf01d3 characteristics 1.1 on-board simulations figure 2. transmission (t amb = 25 c) figure 3. return loss on se port (t amb = 25 c) f (ghz) -0 -5 -10 -15 -20 -25 -30 db 01 2 3 4 5 6 78 2.40 2.44 2.47 2.49 2.50 -5 -7.5 -10 -12.5 -15 2.41 2.42 2.43 2.45 2.46 2.48 f (ghz) db figure 4. return loss on diff port (t amb = 25 c) figure 5. amplitude imbalance (t amb = 25 c) -20 -25 -30 -35 -40 -45 f (ghz) 2.40 2.44 2.47 2.49 2.50 2.41 2.42 2.43 2.45 2.46 2.48 db 0.5 0.3 0.1 0.0 -0.2 -0.4 -0.5 db f (ghz) 2.40 2.44 2.47 2.49 2.50 2.41 2.42 2.43 2.45 2.46 2.48 0.4 0.2 -0.1 -0.3 figure 6. phase imbalance (t amb = 25 c) 10 6 degrees f (ghz) 2.40 2.44 2.47 2.49 2.50 2.41 2.42 2.43 2.45 2.46 2.48 8 4 0 2 -4 -2 -6 -10 -8
application information bal-nrf01d3 4/9 docid023215 rev 3 2 application information figure 7. application schematic (courtesy of nordic semiconductor) figure 8. nrf2723 application board (courtesy of nordic semiconductor) bal-nrf01d3 bal-nrf01d3
docid023215 rev 3 5/9 bal-nrf01d3 application information figure 9. nrf2752 application board (courtesy of nordic semiconductor) bal-nrf01d3
package information bal-nrf01d3 6/9 docid023215 rev 3 3 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions a nd product status are available at: www.st.com . ecopack ? is an st trademark. figure 10. package dimensions (top and side view) figure 11. footprint - non solder mask defined figure 12. footprint - solder mask defined 600 m 205 m se gnd vcc diff diff 1010 50 m 500 m 1475 50m 500 m 433 m 400 m 630 m 60 copper pad diameter: 220m recommended 180m minimum 260m maximum solder mask opening: 320m recommended 300m minimum 340m maximum solder stencil opening: 220m recommended line to connect copper pad on solder mask opening shopuld be smaller than copper pad diameter solder mask opening: 220m recommended 180m minimum 260m maximum copper pad diameter: 320m recommended 300m minimum solder stencil opening : 220m recommended
docid023215 rev 3 7/9 bal-nrf01d3 package information figure 13. marking figure 14. flip chip tape and reel specifications note: more information is available in the stmicroelectronics application notes: an2348 flip-chip: ?package description and recommendations for use? an4111: ?bal-nrf01d3 matched balun with integrated harmonics filter for nordic semiconductor chips with ultralow power transceivers? x y x w z w dot, st logo ecopack grade xx = marking z = manufacturing location yww = datecode dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 4.0 2.0 8.0 1.75 3.5 ? 1.55 0.71 1.1 0.22 1.57 st st st xxz xxz xxz yww yww yww
ordering information bal-nrf01d3 8/9 docid023215 rev 3 4 ordering information 5 revision history table 4. ordering information order code marking weight base qty delivery mode bal-nrf01d3 sc 1.82 mg 5000 tape and reel table 5. document revision history date revision changes 15-oct-2012 1 initial release 13-nov-2012 2 added references to nrf51 series. added figure 9 . updated y-axis labels in figure 2 . 04-mar-2013 3 updated footprint illustrations in figure 11 , and figure 12 .
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